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  to learn more about on semiconductor, please visit our website at www.onsemi.com please note: as part of the fairchild semiconductor integration, some of the fairchild orderable part numbers will need to change in order to meet on semiconductors system requirements. since the on semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the fairchild part numbers will be changed to a dash (-). this document may contain device numbers with an underscore (_). please check the on semiconductor website to verify the updated device numbers. the most current and up-to-date ordering information can be found at www.onsemi.com . please email any questions regarding the system integration to fairchild_questions@onsemi.com . is now part of on semiconductor and the on semiconductor logo are trademarks of semico nductor components industries, llc dba on semiconductor or its subsid iaries in the united states and/or other countries. on semiconductor ow ns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellec tual property. a listing of on semiconductor?s product/patent cover age may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semicon ductor makes no warranty, representation or guarantee regarding the s uitability of its products for any particular purpose, nor does on semico nductor assume any liability arising out of the application or use of any product or circuit, and speci?ca lly disclaims any and all liability, including without limitation spe cial, consequential or incidental damages. buyer is responsible for i ts products and applications using on semiconductor products, including compliance with all laws, regul ations and safety requirements or standards, regardless of any suppor t or applications information provided by on semiconductor. ?typica l? parameters which may be provided in on semiconductor data sheets and/or speci?cations can and do vary in diffe rent applications and actual performance may vary over time. all operat ing parameters, including ?typicals? must be validated for each custo mer application by customer?s technical experts. on semiconductor does not convey any license und er its patent rights nor the rights of others. on semiconductor products a re not designed, intended, or authorized for use as a critical compone nt in life support systems or any fda class 3 medical devices or medical devices with a same or similar classi?ca tion in a foreign jurisdiction or any devices intended for implantation i n the human body. should buyer purchase or use on semiconductor products fo r any such unintended or unauthorized application, buyer shall indemnify and hold on semico nductor and its of?cers, employees, subsidiaries, af?liates, and di stributors harmless against all claims, costs, damages, and expense s, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associa ted with such unintended or unauthorized use, even if such claim alleges th at on semiconductor was negligent regarding the design or manufacture o f the part. on semiconductor is an equal opportunity/af?rmative action employer. this literatu re is subject to all applicable copyright laws and is not for resale in any manne r.
FNB43060T2 motion spm? 45 series march 2016 ?2016 fairchild semiconductor corporation 1 www.fairchildsemi.com FNB43060T2 rev.1.1 FNB43060T2 motion spm ? 45 series features ul certified no. e209204 (ul1557) 600 v - 30 a 3-phase igbt inverter with integral gate drivers and protection low thermal resistance using ceramic substrate low-loss, short-circuit rated igbts built-in bootstrap diodes and dedicated vs pins sim- plify pcb layout built-in ntc thermistor for temperature monitoring separate open-emitter pins from low-side igbts for three-phase current sensing single-grounded power supply isolation rating: 2000 v rms / min. applications motion control - home appliance / industrial motor related resources an-9084 - smart power module, motion spm? 45 h v3 series users guilde an-9072 - smart power module motion spm? in spm45h thermal performance information an-9071 - smart power module motion spm? in spm45h mounting guidance an-9760 - pcb design guidance for spm? general description FNB43060T2 is an advanced motion spm ? 45 module providing a fully-featured, high-performance inverter output stage for ac induction, bldc, and pmsm motors. these modules integrate optimized gate drive of the built-in igbts to minimize emi and losses, while also providing multiple on-module protec tion features including under-voltage lockouts, over-current shutdown, thermal monitoring of drive ic, and fault reporting. the built-in, high-speed hvic r equires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module's internal igbts. separate negative igbt terminals are available for each phase to support the widest variety of control algorithms. package marking and ordering inform ation figure 1. 3d package drawing (click to activate 3d content) device device marking package packing type quantity FNB43060T2 FNB43060T2 spmab-c26 rail 12
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 2 www.fairchildsemi.com FNB43060T2 rev.1.1 integrated power functions 600 v - 30 a igbt inverter for three-phase dc / ac power conversion (please refer to figure 3) integrated drive, protection, and system control functions for inverter high-side igbts: gate drive circ uit, high-voltage isolated high-speed level shifting control circuit under-voltage lock-out protection (uvlo) note: available bootstrap circuit ex ample is given in figures 15. for inverter low-side igbts: gate driv e circuit, short-circuit protection (scp) control supply circuit under-voltage lock-out protection (uvlo) fault signaling: corresponding to uvlo (low-side supply) and sc faults input interface: active-high interface, wor ks with 3.3 / 5 v logic, schmitt-trigger input pin configuration figure 2. top view
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 3 www.fairchildsemi.com FNB43060T2 rev.1.1 pin descriptions pin number pin name pin description 1v th thermistor bias voltage 2r th series resistor for the use of thermistor (temperature detection) 3 p positive dc-link input 4 u output for u-phase 5 v output for v-phase 6 w output for w-phase 7n u negative dc-link input for u-phase 8n v negative dc-link input for v-phase 9n w negative dc-link input for w-phase 10 c sc shut down input for short-circuit current detection input 11 v fo fault output 12 in (wl) signal input for low-side w-phase 13 in (vl) signal input for low-side v-phase 14 in (ul) signal input for low-side u-phase 15 com common supply ground 16 v dd(l) low-side common bias voltage for ic and igbts driving 17 v dd(h) high-side common bias voltage for ic and igbts driving 18 in (wh) signal input for high-side w-phase 19 in (vh) signal input for high-side v-phase 20 in (uh) signal input for high-side u-phase 21 v s(w) high-side bias voltage ground for w-phase igbt driving 22 v b(w) high-side bias voltage for w-phase igbt driving 23 v s(v) high-side bias voltage ground for v-phase igbt driving 24 v b(v) high-side bias voltage for v-phase igbt driving 25 v s(u) high-side bias voltage ground for u-phase igbt driving 26 v b(u) high-side bias voltage for u-phase igbt driving
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 4 www.fairchildsemi.com FNB43060T2 rev.1.1 internal equivalent circ uit and input/output pins figure 3. internal block diagram note: 1. inverter high-side is composed of three igbts, freewheeling diodes, and one control ic for each igbt . 2. inverter low-side is composed of three igbts, freewheeling diodes, and one control ic for each igbt. it has gate drive and p rotection functions. 3. inverter power side is composed of four inverter dc-link input terminals and three inverter outp ut terminals. com vdd in(wl) in(vl) in(ul) vfo csc out(wl) out(vl) out(ul) n w (9) n v (8) n u (7) w(6) v (5) u(4) p (3) (25) v s(u) (26) v b(u) (23) v s(v) (24) v b(v) (10) c sc (11) v fo (12) in (wl) (13) in (vl) (14) in (ul) (15) com uvb out(uh) uvs in(uh) wvs wvs out(wh) in(wh) com vdd wvb out(vh) vvs in(vh) v th (1) (19) in (vh) (20) in (uh) (21) v s(w) (22) v b(w) (17) v dd(h) (18) in (wh) r th (2) thermistor uvs vvs vvb (16) v dd(l)
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 5 www.fairchildsemi.com FNB43060T2 rev.1.1 absolute maximum ratings (t j = 25c, unless otherwise specified.) inverter part control part bootstrap diode part total system thermal resistance note: 4. these values had been made an acquisition by the calculation considered to des ign factor. 5. for the measurement point of case temperature (t c ), please refer to figure 2. symbol parameter conditions rating unit v pn supply voltage applied between p - n u , n v , n w 450 v v pn(surge) supply voltage (surge) applied between p - n u , n v , n w 500 v v ces collector - emitter voltage 600 v i c each igbt collector current t c = 25c, t j 150c 30 a i cp each igbt collector current (peak) t c = 25c, t j 150c, under 1 ms pulse width (note 4) 60 a p c collector dissipation t c = 25c per one chip (note 4) 59 w t j operating junction temperature - 40 ~ 150 c symbol parameter conditions rating unit v dd control supply voltage applied between v dd(h) , v dd(l) - com 20 v v bs high - side control bias voltage applied between v b(u) - v s(u) , v b(v) - v s(v) , v b(w) - v s(w) 20 v v in input signal voltage applied between in (uh) , in (vh) , in (wh) , in (ul) , in (vl) , in (wl) - com -0.3 ~ v dd + 0.3 v v fo fault output supply voltage applied between v fo - com -0.3 ~ v dd + 0.3 v i fo fault output current sink current at v fo pin 1 ma v sc current-sensing input voltage applied between c sc - com -0.3 ~ v dd + 0.3 v symbol parameter conditions rating unit v rrm maximum repetitive reverse voltage 600 v i f forward current t c = 25c, t j 150c 0.5 a i fp forward current (peak) t c = 25c, t j 150c, under 1 ms pulse width (note 4) 2.0 a t j operating junction temperature -40 ~ 150 c symbol parameter conditions rating unit v pn(prot) self-protection supply voltage limit (short-circuit protection capability) v dd = v bs = 13.5 ~ 16.5 v t j = 150c, non-repetitive, < 2 ? s 400 v t c module case operation temperature see figure 2 -40 ~ 125 c t stg storage temperature -40 ~ 125 c v iso isolation voltage 60 hz, sinusoidal, ac 1 minute, connect pins to heat sink plate 2000 v rms symbol parameter conditions min. typ. max. unit r th(j-c)q junction to case thermal resistance (note 5) inverter igbt part (per 1 / 6 module) - - 2.1 c / w r th(j-c)f inverter fwdi part (per 1 / 6 module) - - 2.8 c / w
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 6 www.fairchildsemi.com FNB43060T2 rev.1.1 electrical characteristics (t j = 25c, unless otherwise specified.) inverter part note: 6. t on and t off include the propagation delay time of the internal drive ic. t c(on) and t c(off) are the switching time of igbt itself under the given gate driving condition internally. for the detailed information, please see figure 4 . figure 4. switching time definition symbol parameter conditions min. typ. max. unit v ce(sat) collector - emitter saturation voltage v dd = v bs = 15 v v in = 5 v i c = 30 a, t j = 25c - 1.65 2.25 v v f fwdi forward voltage v in = 0 v i f = 30 a, t j = 25c - 2.00 2.60 v hs t on switching times v pn = 300 v, v dd = v bs = 15 v, i c = 30 a t j = 25c v in = 0 v ? 5 v, inductive load (note 6) 0.45 0.85 1.35 ? s t c(on) -0 . 2 00 . 5 0 ? s t off -0 . 7 01 . 2 0 ? s t c(off) -0 . 1 50 . 4 5 ? s t rr -0 . 1 0- ? s ls t on v pn = 300 v, v dd = v bs = 15 v, i c = 30 a t j = 25c v in = 0 v ? 5 v, inductive load (note 6) 0.5 0.90 1.40 ? s t c(on) -0 . 3 00 . 6 0 ? s t off -0 . 8 01 . 3 0 ? s t c(off) -0 . 1 50 . 4 5 ? s t rr -0 . 1 5- ? s i ces collector - emitter leakage current v ce = v ces --1m a v ce i c v in t on t c(on) v in(on) 10% i c 10% v ce 90% i c 100% i c t rr 100% i c v ce i c v in t off t c(off) v in(off) 10% v ce 10% i c (a) turn-on (b) turn-off
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 7 www.fairchildsemi.com FNB43060T2 rev.1.1 figure 5. switching loss ch aracteristics (typical) control part note: 7. short-circuit current protection is functioning only at the low-sides. 8. t th is the temperature of thermistor itselt. to know case temperature (t c ), please make the experiment considering your application. symbol parameter conditions min. typ. max. unit i qddh quiescent v dd supply current v dd(h) = 15 v, in (uh,vh,wh) = 0 v v dd(h) - com - - 0.10 ma i qddl v dd(l) = 15 v, in (ul,vl, wl) = 0 v v dd(l) - com - - 2.65 ma i pddh operating v dd supply current v dd(h) = 15 v, f pwm = 20 khz, duty = 50%, applied to one pwm sig- nal input for high-side v dd(h) - com - - 0.15 ma i pddl v dd(l) = 15 v, f pwm = 20 khz, duty = 50%, applied to one pwm sig- nal input for low-side v dd(l) - com - - 4.00 ma i qbs quiescent v bs supply current v bs = 15 v, in (uh, vh, wh) = 0 v v b(u) - v s(u) , v b(v) - v s(v) , v b(w) - v s(w) - - 0.30 ma i pbs operating v bs supply current v dd = v bs = 15 v, f pwm = 20 khz, duty = 50%, applied to one pwm signal input for high-side v b(u) - v s(u) , v b(v) - v s(v) , v b(w) - v s(w) - - 2.00 ma v foh fault output voltage v sc = 0 v, v fo circuit: 4.7 k ? to 5 v pull-up 4.5 - - v v fol v sc = 1 v, v fo circuit: 4.7 k ? to 5 v pull-up - - 0.5 v v sc(ref) short circuit trip level v dd = 15 v (note 7) c sc - c o m 0 . 4 50 . 5 00 . 5 5 v uv ddd supply circuit under-voltage protection detection level 10.5 - 13.0 v uv ddr reset level 11.0 - 13.5 v uv bsd detection level 10.0 - 12.5 v uv bsr reset level 10.5 - 13.0 v t fod fault-out pulse width 30 - - ? s v in(on) on threshold voltage applied between in (uh, vh, wh) - com, in (ul, vl, wl) - com --2 . 6v v in(off) off threshold voltage 0.8 - - v r th resistance of thermistor @t th = 25c, (note 8) - 47 - k ? @t th = 100c - 2.9 - k ? 0 5 10 15 20 25 30 0 200 400 600 800 1000 1200 1400 1600 1800 2000 inductive load, v pn = 300v, v dd =15v, t j =150 switching loss e sw [uj] collector current, i c [amperes] igbt turn-on, eon igbt turn-off, eoff frd turn-off, erec 0 5 10 15 20 25 30 0 200 400 600 800 1000 1200 1400 1600 1800 2000 switching loss e sw [uj] collector current, i c [amperes] igbt turn-on, eon igbt turn-off, eoff frd turn-off, erec inductive load, v pn = 300v, v dd =15v, t j =25
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 8 www.fairchildsemi.com FNB43060T2 rev.1.1 figure. 6. r-t curve of the built-in thermistor bootstrap diode part figure 7. built-in bootstrap diode characteristic note: 9. built-in bootstrap diode includes around 15 ? resistance characteristic. symbol parameter conditions min. typ. max. unit v f forward voltage i f = 0.1 a, t c = 25c - 2.5 - v t rr reverse-recovery time i f = 0.1 a, di f / dt = 50 a / ? s, t j = 25c - 80 - ns -20-10 0 102030405060708090100110120 0 50 100 150 200 250 300 350 400 450 500 550 600 r-t curve resistance[k ? ] temperature t th [] 50 60 70 80 90 100 110 120 0 4 8 12 16 20 resistance[k ? ] temperature [ ] r-t curve in 50 ~ 125 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 built-in bootstrap diode v f -i f characteristic t c =25 o c i f [a] v f [v]
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 9 www.fairchildsemi.com FNB43060T2 rev.1.1 recommended oper ating conditions note: 10. this product might not make response if input pulse width is less than the recommanded value. figure 8. allowable maximum output current note: 11. this allowable output current value is the reference data for the safe operation of this product. this may be diff erent fro m the actual application and operating condition. symbol parameter conditions min. typ. max. unit v pn supply voltage applied between p - n u , n v , n w - 300 400 v v dd control supply voltage applied between v dd(h) , v dd(l) - com 13.5 15.0 16.5 v v bs high-side bias voltage applied between v b(u) - v s(u) , v b(v) - v s(v) , v b(w) - v s(w) 13.0 15.0 18.5 v dv dd / dt, dv bs / dt control supply variation -1 - 1 v / ? s t dead blanking time for preventing arm-short for each input signal 1.0 - - ? s f pwm pwm input signal -40 ? c ?? t c ?? 125c, -40 ? c ?? t j ?? 150c - - 20 khz v sen voltage for current sensing applied between n u , n v , n w - com (including surge-voltage) -4 4 v p win(on) minimum input pulse width v dd = v bs = 15 v, i c ?? 60 a, wiring inductance between n u, v, w and dc link n < 10nh (note 10) 1.2 - - ? s p win(off) 1.2 - - t j junction temperature - 40 - 150 ? c 0 20 40 60 80 100 120 140 0 7 14 21 28 v dc = 300 v, v dd = v bs = 15 v t j = 150 , t c = 125 m.i. = 0.9, p.f. = 0.8 sinusoidal pwm f sw = 15 khz f sw = 5 khz allowable output current, i orms [a rms ] case temperature, t c [ ]
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 10 www.fairchildsemi.com FNB43060T2 rev.1.1 mechanical characteristics and ratings figure 9. flatness measurement position figure 10. mounting screws torque order note: 12. do not make over torque when mounting screws. much mounting torque may cause cera mic cracks, as well as bolts and al heat-s ink destruction. 13. avoid one-sided tightening stress. figure 10 shows the recommended torque order for moun ting screws. uneven mounting can ca use the ceramic substrate of package to be damaged. the pre-screwing torque is set to 20 ~ 30% of maximum torque rating. parameter conditions min. typ. max. unit device flatness see figure 9 0-+ 1 2 0 ? m mounting torque mounting screw: m3 see figure 10 recommended 0.7 n m 0.6 0.7 0.8 n m recommended 7.1 kg cm 6.2 7.1 8.1 kg cm weight - 11.00 - g 1 2 pre - screwing : 1 2 final screwing : 2 1 1 2 pre - screwing : 1 2 final screwing : 2 1
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 11 www.fairchildsemi.com FNB43060T2 rev.1.1 time charts of protective function figure 11. under-voltage protection (low-side) a1 : control supply voltage rises: after the voltage rises uv ddr , the circuits start to operate when next input is applied. a2 : normal operation: igbt on and carrying current. a3 : under voltage detection (uv ddd ). a4 : igbt off in spite of control input condition. a5 : fault output operation starts with a fixed pulse width. a6 : under voltage reset (uv ddr ). a7 : normal operation: igbt on and carrying curr ent by triggering next signal from low to high. figure 12. under-voltage protection (high-side) b1 : control supply voltage rises: after the voltage reaches uv bsr , the circuits start to operate when next input is applied. b2 : normal operation: igbt on and carrying current. b3 : under voltage detection (uv bsd ). b4 : igbt off in spite of control input c ondition, but there is no fault output signal. b5 : under voltage reset (uv bsr ). b6 : normal operation: igbt on and carrying curr ent by triggering next signal from low to high. input signal output current fault output signal control supply voltage reset uv ddr protection circuit state set reset uv ddd a1 a3 a2 a4 a6 a5 a7 input signal output current fault output signal control supply voltage reset uv bsr protection circuit state set reset uv bsd b1 b3 b2 b4 b6 b5 high-level (no fault output)
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 12 www.fairchildsemi.com FNB43060T2 rev.1.1 figure 13. short-circuit protection (low-side operation only) (with the external sense resistance and rc filter connection) c1 : normal operation: igbt on and carrying current. c2 : short circuit current detection (sc trigger). c3 : all low-side igbts gate are hard interrupted. c4 : all low-side igbts turn off. c5 : fault output operation star ts with a fixed pulse width. c6 : input high: igbt on state, but during the acti ve period of fault output the igbt doesnt turn on. c7 : fault output operation finishes, but igbt doesnt turn on until trig gering next signal from low to high. c8 : normal operation: igbt on and carrying current. input/output interface circuit figure 14. recommended mcu i/o interface circuit note: 14. rc coupling at each input might change depending on the pwm control scheme used in the appli cation and the wiring impedance of the applications printed circuit board. the input signal section of the motion spm 45 product integrates 5 k ? ( typ.) pull-down resistor. therefore, when using an exte rnal filtering resistor, please pay attention to the signal voltage drop at input terminal. lower arms control input output current sensing voltage of shunt resistance fault output signal sc reference voltage cr circuit time constant delay sc protection circuit state set reset c6 c7 c3 c2 c1 c8 c4 c5 internal igbt gate - emitter voltage mcu com +5 v (for mcu or control power) ,, in (ul) in (vl) in (wl) ,, in (uh) in (vh) in (wh) v fo r pf = 10 k ? spm
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 13 www.fairchildsemi.com FNB43060T2 rev.1.1 figure 15. typical application circuit note: 15. to avoid malfunction, the wiring of each input should be as short as possible (less than 2 - 3 cm). 16. v fo output is open-drain type. this signal line should be pulled up to the positive side of the mcu or control power supply with a resistor that makes i fo up to 1 ma. 17. c sp15 of around seven times larger than bootstrap capacitor c bs is recommended. 18. input signal is active -high type. there is a 5 k ? resistor inside the ic to pull down each input signal line to gnd. rc coupling circuits is recommanded for the prevention of input signal oscillation. r s c ps time constant should be selected in the range 50 ~ 150 ns ( recommended r s = 100 ? , c ps = 1 nf). 19. to prevent errors of the protection function, the wiring around r f and c sc should be as short as possible. 20. in the short-circuit protection circuit, please select the r f c sc time constant in the range 1.5 ~ 2 ? s. do enough evaluaiton on the real system because short-circuit protection time may vary wiring pattern layout and value of the r f c sc time constant. 21. the connection between control gnd line and power gnd line which includes the n u , n v , n w must be connected to only one point. please do not connect the control gnd to the power gnd by the broad pattern. also, the wiring distance between control gnd and power gn d should be as short as possib le. 22. each capacitor should be mounted as close to the pins of the motion spm 45 product as possible. 23. to prevent surge destruction, the wiring between the smoothing capacitor and the p & gnd pins should be as sh ort as possib le. the use of a high-frequency non-inductive capacitor of around 0.1 ~ 0.22 ? f between the p and gnd pins is recommended. 24. relays are used in almost every systems of electrical equipmen t in home appliances. in these cases, there should be suffic ient distance between the mcu and the relays. 25. the zener diode or transient voltage suppressor should be adopted for the protection of ics from the surge de struction betw een each pair of control supply terminals (recommanded zener diode is 22 v / 1 w, which has the lower zener impedance characteristic than about 15 ? ). 26. please choose the electrolytic capacitor with good temperature characteristic in c bs . also, choose 0.1 ~ 0.2 ? f r-category ceramic capacitors with good temperature and frequency characteristics in c bsc . fault +15 v c bs c bsc c bs c bsc c bs c bsc c sp15 c spc15 r pf c bpf r s m v dc c dcs gating uh gating vh gating wh gating ul gating vl gating wl c pf m cu r sw r sv r su u-phase current v-phase current w-phase current r f com vdd in(wl) in(vl) in(ul) vfo csc out(wl) out(vl) out(ul) n w (9) n v (8) n u (7) w (6) v (5) u (4) p (3) (25) v s(u) (26) v b(u) (23) v s(v) (24) v b(v) (10) c sc (11) v fo (14) in (ul) (13) in (vl) (12) in (wl) (20) in (uh) (19) in (vh) (21) v s(w) (22) v b(w) (17) v dd(h) (18) in (wh) input signal for short-circuit protection c sc r s r s r s r s r s r s c ps c ps c ps c ps c ps c ps in(wh) in(vh) in(uh) com vdd vs(w) vs(v) vs(u) vs(v) vs(u) vs(w) vb(u) vb(v) vb(w) (15) com out(wh) out(vh) out(uh) lvic hvic (1) v th (2) r th r th thermistor temp. monitoring (16) v dd(l) +5 v c spc05 c sp05
FNB43060T2 motion spm? 45 series ?2016 fairchild semiconductor corporation 14 www.fairchildsemi.com FNB43060T2 rev.1.1 detailed package outline drawings (FNB43060T2) package drawings are provided as a servic e to customers considering fairchild co mponents. drawings may change in any manner without notice. please note the revision and/or data on the drawing and contact a fairchildsemiconductor representative to veri fy or obtain the most recent revision. package s pecifications do not expand the terms of fa irchilds worldwide therm and conditions, specifically the the warranty therein, which covers fairchild products. always visit fairchild semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/mo/mod26aa.pdf
?2016 fairchild semiconductor corporation 15 www.fairchildsemi.com FNB43060T2 rev.1.1
www. onsemi.com 1 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. typical parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including typic als must be validated for each customer application by customers technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 www.onsemi.com literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your localsales representative ? semiconductor components industries, llc


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